VPTek

STORM 3000是 VPTek 第三代 IC Mask 缺陷检测产品，经过数年不断测试与持续改进，STORM 3000 已取得业界领先客户的评估认可。 STORM 3000 基于先进的雷射成像技术与高灵敏度的软件算法，可具备 DB、DD、SL 等检测模式，适用于 Mask Shop、FAB 对光罩生产过程、出货、及定期检测的需求，针对 180/130nm 制程，具有高精度、高效率及容易使用等优势。

Key Features
—   Ultra high resolution optical system based on UV laser
—   Support simultaneous inspection of reflected and transmitted light
—   Support DD, SL, and DB inspection modes
—   Supports SMIF Pod, Nikon CASE, Canon CASE, Shipping Box and other film boxes
—   Supports GDS, OASIS, MEBES file formats
—   Supports Binary and PSM masks
—   Support OPC calibration
—   Support GPU distributed computing
 

STORM 3000U 是 VPTek 新一代针对 IC Mask 基板缺陷检测产品，基于已被认可的STORM 3000 平台架构，在光学成像、传输及快取进行相应的优化、以提升易用性及降低设备成本。适用于 Mask Blank 基板生产、出货及 Mask shop 来料检测需求，针对 200nm 检测精度，具有高效率、容易使用及低成本等优势。新产品发表-VPTek IC Mask inspection 设备

Key Features
—   Laser based ultra-high resolution optical system
—   Support SMIF Pod automatic loading and unloading
—   Support particle, scratch, pinhole, and dirt inspection
—   Support automatic review and defect classification
—   Support polishing plates, chrome plates, and post adhesive testing
—   Support automatic grading and caching of substrates
—   Support GPU distributed computing
 

IRIS 530 是 VPTek 针对 IC Mask 所推出的双表面颗粒检测设备，系统采用上下两组光学系统与明场、暗场照明模式。可同时侦测 Pellicle 及 Glass 面的颗粒及脏污侦测，适用于 Mask shop 出货侦测、FAB 厂日常监控。

Key Features 
—   Simultaneously detect particles on the glass surface and pellicle surface
—   Compatible with RSP200 Nikon Case、Opening of Crystal Box and Automatic Upper and Lower Plate
—   Inspection method based on bright field and dark field
—   Pellicle surface, glass surface, inner and outer inspection areas of membrane frame can be flexibly set
—   Visual display of the relationship between defect location and graphic location
—   Configure an air bath knife to remove surface particles
 

Tornado 2000 是 VPTek 推出针对次微米级精度的晶圆全自动光学检测设备，先进的双光路光学影像系统及多种照明方案，适应各类不同材质的光学影像问题，支持D2D、D2G、C2C、D2DB、AI 等检测模式，可适用大尺寸 DIE、非数组式排布的晶圆缺陷，Tornado 2000 灵活的软硬件配置，可适用于前段、后段制程的缺陷侦测。具备灵活易用、高效率、低成本等重大优势。 

Application Scenarios  
针对4、6、8吋晶圆前段、中段、后段及先进封装过程中的表面2D及3D缺陷检测

Key Features
    Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
    Dual Port cyclic loading and unloading reduces operator waiting time
    Supports bright and dark field illumination to better capture subtle defects
    Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D、D2G and D2DB inspection algorithm
    Support AI defect inspection and classification
    Support data integration with customer MES systems

 

Tornado 2100 是 VPTek 推出的晶圆全自动光学 CD 及 OVERLAP 测量设备，以高分辨率的光学影像系统为基础，进一步提升图形对比度并减少了过渡像素。搭配高效能移动平台，提高了量测过程中定位的效率，减少了稳态抖动，并满足了量测重复性的严格要求。 

Application Scenarios 
针对4、6、8吋晶圆前段制程中的 CD 及 OVERLAP 精度的测量

Key Features
    Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
    Support automatic measurement based on Recipe
    Support multiple wavelength lighting and optical systems including white light, RGB, and UV
    Support multiple line width measurement methods such as grayscale threshold, grayscale change rate, and line fitting
    Multi hold non-linear compensation function
    Support line width measurement under low contrast conditions
 

Tornado 3000 是 VPTek 推出针对 8、12 吋次微米级精度的晶圆全自动光学检测设备，基于 Tornado 2000 的成熟架构，透过对光学系统的进一步升级优化，不断提升光学系统影像分辨率，以适应更为苛刻的制程要求。

Application Scenarios  
针对 8、12 吋晶圆前段、中段、及先进封装过程中的 2D、3D 缺陷检测

Key Features  
    Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
    Dual light path array + area array imaging system, fast scanning
    UV based optical system can better capture subtle defects
    Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D, D2G, D2DB inspection algorithms
    Support AI defect inspection and classification
    Support data integration with customer MES systems