VPTek

The STORM 3000 is VPTek’s third-generation IC mask defect inspection product. After years of continuous testing and ongoing refinement, the STORM 3000 has obtained evaluation recognition from leading customers in the industry. Based on advanced laser imaging technology and highly sensitive software algorithms, the STORM 3000 supports DB, DD, and SL inspection modes, making it suitable for the mask production process, outgoing inspection, and periodic inspection needs of mask shops and fabs. Targeting 180/130 nm process nodes, it offers the advantages of high precision, high efficiency, and ease of use.

Key Features

• Ultra high resolution optical system based on UV laser
• Support simultaneous inspection of reflected and transmitted light
• Support DD, SL, and DB inspection modes
• Supports SMIF Pod, Nikon CASE, Canon CASE, Shipping Box and other film boxes
• Supports GDS, OASIS, MEBES file formats
• Supports Binary and PSM masks
• Support OPC calibration
• Support GPU distributed computing

The STORM 3000U is VPTek’s next-generation IC mask substrate defect inspection product. Built on the proven STORM 3000 platform architecture, it incorporates targeted optimizations in optical imaging, data transmission, and caching to improve ease of use and reduce equipment costs. Designed for mask blank substrate production, outgoing inspection, and incoming inspection at mask shops, the STORM 3000U targets 200 nm inspection precision and offers the advantages of high efficiency, ease of use, and low cost.

Key Features

• Laser based ultra-high resolution optical system
• Support SMIF Pod automatic loading and unloading
• Support particle, scratch, pinhole, and dirt inspection
• Support automatic review and defect classification
• Support polishing plates, chrome plates, and post adhesive testing
• Support automatic grading and caching of substrates
• Support GPU distributed computing

The IRIS 530 is VPTek’s dual-surface particle inspection system for IC masks. The system employs upper and lower optical assemblies along with both brightfield and darkfield illumination modes. Capable of simultaneously detecting particles and contamination on both the pellicle and glass surfaces, it is suitable for outgoing inspection at mask shops as well as routine monitoring in fab environments.

Key Features

• Simultaneously detect particles on the glass surface and pellicle surface
• Compatible with RSP200 Nikon Case、Opening of Crystal Box and Automatic Upper and Lower Plate
• Inspection method based on bright field and dark field
• Pellicle surface, glass surface, inner and outer inspection areas of membrane frame can be flexibly set
• Visual display of the relationship between defect location and graphic location
• Configure an air bath knife to remove surface particles

The Tornado 2100 is VPTek’s fully automated optical CD and overlay measurement system for wafers. Built on a high-resolution optical imaging platform, it further enhances pattern contrast and reduces transitional pixels. Paired with a high-performance motion stage, it improves positioning efficiency during measurement, reduces steady-state jitter, and meets stringent requirements for measurement repeatability.

Application Scenarios

CD and overlay precision measurement for 4-, 6-, and 8-inch wafers in front-end processes

Key Features

• Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
• Support automatic measurement based on Recipe
• Support multiple wavelength lighting and optical systems including white light, RGB, and UV
• Support multiple line width measurement methods such as grayscale threshold, grayscale change rate, and line fitting
• Multi hold non-linear compensation function
• Support line width measurement under low contrast conditions

The Tornado 2100 is VPTek’s fully automated optical CD and overlay measurement system for wafers. Built on a high-resolution optical imaging platform, it further enhances pattern contrast and reduces transitional pixels. Paired with a high-performance motion stage, it improves positioning efficiency during measurement, reduces steady-state jitter, and meets stringent requirements for measurement repeatability.

Application Scenarios 

CD and overlay precision measurement for 4-, 6-, and 8-inch wafers in front-end processes

Key Features

• Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
• Support automatic measurement based on Recipe
• Support multiple wavelength lighting and optical systems including white light, RGB, and UV
• Support multiple line width measurement methods such as grayscale threshold, grayscale change rate, and line fitting
• Multi hold non-linear compensation function
• Support line width measurement under low contrast conditions

The Tornado 3000 is VPTek’s fully automated optical wafer inspection system for 8- and 12-inch wafers at sub-micron precision. Built on the proven Tornado 2000 architecture, it delivers continuous improvements in optical imaging resolution through further optimization of the optical system, enabling it to meet increasingly demanding process requirements.

Application Scenarios

2D and 3D defect inspection for 8- and 12-inch wafers across front-end, mid-end, and advanced packaging processes

Key Features

• Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
• Dual light path array + area array imaging system, fast scanning
• UV based optical system can better capture subtle defects
• Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
• Support partition inspection with multiple ROIs and layers
• Support D2D, D2G, D2DB inspection algorithms
• Support AI defect inspection and classification
• Support data integration with customer MES systems