VPTek

STORM 3000是 VPTek 第三代 IC Mask 缺陷檢測產品，經過數年不斷測試與持續改進，STORM 3000 已取得業界領先客戶的評估認可。 STORM 3000 基於先進的雷射成像技術與高靈敏度的軟體演算法，可具備 DB、DD、SL 等檢測模式，適用於 Mask Shop、FAB 對光罩生產過程、出貨、及定期檢測的需求，針對 180/130nm 制程，具有高精度、高效率及容易使用等優勢。

Key Features
—   Ultra high resolution optical system based on UV laser
—   Support simultaneous inspection of reflected and transmitted light
—   Support DD, SL, and DB inspection modes
—   Supports SMIF Pod, Nikon CASE, Canon CASE, Shipping Box and other film boxes
—   Supports GDS, OASIS, MEBES file formats
—   Supports Binary and PSM masks
—   Support OPC calibration
—   Support GPU distributed computing

 

STORM 3000U 是 VPTek 新一代針對 IC Mask 基板缺陷檢測產品，基於已被認可的STORM 3000 平臺架構，在光學成像、傳輸及快取進行相應的優化、以提升易用性及降低設備成本。適用於 Mask Blank 基板生產、出貨及 Mask shop 來料檢測需求，針對 200nm 檢測精度，具有高效率、容易使用及低成本等優勢。新產品發表-VPTek IC Mask inspection 設備

Key Features
—   Laser based ultra-high resolution optical system
—   Support SMIF Pod automatic loading and unloading
—   Support particle, scratch, pinhole, and dirt inspection
—   Support automatic review and defect classification
—   Support polishing plates, chrome plates, and post adhesive testing
—   Support automatic grading and caching of substrates
—   Support GPU distributed computing

IRIS 530 是 VPTek 針對 IC Mask 所推出的雙表面顆粒檢測設備，系統採用上下兩組光學系統與明場、暗場照明模式。可同時偵測 Pellicle 及 Glass 面的顆粒及髒汙偵測，適用於 Mask shop 出貨偵測、FAB 廠日常監控。

Key Features 
—   Simultaneously detect particles on the glass surface and pellicle surface
—   Compatible with RSP200 Nikon Case、Opening of Crystal Box and Automatic Upper and Lower Plate
—   Inspection method based on bright field and dark field
—   Pellicle surface, glass surface, inner and outer inspection areas of membrane frame can be flexibly set
—   Visual display of the relationship between defect location and graphic location
—   Configure an air bath knife to remove surface particles

 

Tornado 2000 是 VPTek 推出針對次微米級精度的晶圓全自動光學檢測設備，先進的雙光路光學影像系統及多種照明方案，適應各類不同材質的光學影像問題，支援D2D、D2G、C2C、D2DB、AI 等檢測模式，可適用大尺寸 DIE、非陣列式排布的晶圓缺陷，Tornado 2000 靈活的軟硬體配置，可適用於前段、後段製程的缺陷偵測。具備靈活易用、高效率、低成本等重大優勢。

Application Scenarios
針對4、6、8吋晶圓前段、中段、後段及先進封裝過程中的表面2D及3D缺陷檢測

Key Features 
    Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
    Dual Port cyclic loading and unloading reduces operator waiting time
    Supports bright and dark field illumination to better capture subtle defects
    Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D、D2G and D2DB inspection algorithm
    Support AI defect inspection and classification
    Support data integration with customer MES systems




 

Tornado 2100 是 VPTek 推出的晶圓全自動光學 CD 及 OVERLAP 測量設備，以高解析度的光學影像系統為基礎，進一步提升圖形對比度並減少了過渡像素。搭配高效能移動平台，提高了量測過程中定位的效率，減少了穩態抖動，並滿足了量測重複性的嚴格要求。 

Application Scenarios 
針對4、6、8吋晶圓前段製程中的 CD 及 OVERLAP 精度的測量

Key Features
    Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
    Support automatic measurement based on Recipe
    Support multiple wavelength lighting and optical systems including white light, RGB, and UV
    Support multiple line width measurement methods such as grayscale threshold, grayscale change rate, and line fitting
    Multi hold non-linear compensation function
    Support line width measurement under low contrast conditions


 

Tornado 3000 是 VPTek 推出針對 8、12 吋次微米級精度的晶圓全自動光學檢測設備，基於 Tornado 2000 的成熟架構，透過對光學系統的進一步升級最佳化，不斷提升光學系統影像解析度，以適應更為苛刻的製程要求。

Application Scenarios  
針對 8、12 吋晶圓前段、中段、及先進封裝過程中的 2D、3D 缺陷檢測

Key Features  
    Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
    Dual light path array + area array imaging system, fast scanning
    UV based optical system can better capture subtle defects
    Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D, D2G, D2DB inspection algorithms
    Support AI defect inspection and classification
    Support data integration with customer MES systems