Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient  Dual Port cyclic loading and unloading reduces operator waiting time  Supports bright and dark field illumination to better capture subtle defects  Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers  Support partition inspection with multiple ROIs and layers  Support D2D、D2G and D2DB inspection algorithm  Support AI defect inspection and classification  Support data integration with customer MES systems