Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient Dual Port cyclic loading and unloading reduces operator waiting time Supports bright and dark field illumination to better capture subtle defects Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers Support partition inspection with multiple ROIs and layers Support D2D、D2G and D2DB inspection algorithm Support AI defect inspection and classification Support data integration with customer MES systems