Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette Dual light path array + area array imaging system, fast scanning UV based optical system can better capture subtle defects Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers Support partition inspection with multiple ROIs and layers Support D2D, D2G, D2DB inspection algorithms Support AI defect inspection and classification Support data integration with customer MES systems