型号: Tornado3000

VPTek Tornado 3000

Wafer surface defect inspection设备

数量
Tornado 3000 是 VPTek 推出针对 8、12 吋次微米级精度的晶圆全自动光学检测设备,基于 Tornado 2000 的成熟架构,透过对光学系统的进一步升级优化,不断提升光学系统影像分辨率,以适应更为苛刻的制程要求。

Application Scenarios

针对 8、12 吋晶圆前段、中段、及先进封装过程中的 2D、3D 缺陷检测

Key Features

    Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
    Dual light path array + area array imaging system, fast scanning
    UV based optical system can better capture subtle defects
    Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D, D2G, D2DB inspection algorithms
    Support AI defect inspection and classification
    Support data integration with customer MES systems
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