型號: Tornado3000

VPTek Tornado 3000

Wafer surface defect inspection設備

數量
Tornado 3000 是 VPTek 推出針對 8、12 吋次微米級精度的晶圓全自動光學檢測設備,基於 Tornado 2000 的成熟架構,透過對光學系統的進一步升級最佳化,不斷提升光學系統影像解析度,以適應更為苛刻的製程要求。

Application Scenarios

針對 8、12 吋晶圓前段、中段、及先進封裝過程中的 2D、3D 缺陷檢測

Key Features

    Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
    Dual light path array + area array imaging system, fast scanning
    UV based optical system can better capture subtle defects
    Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
    Support partition inspection with multiple ROIs and layers
    Support D2D, D2G, D2DB inspection algorithms
    Support AI defect inspection and classification
    Support data integration with customer MES systems
 
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