Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette  Dual light path array + area array imaging system, fast scanning  UV based optical system can better capture subtle defects  Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers  Support partition inspection with multiple ROIs and layers  Support D2D, D2G, D2DB inspection algorithms  Support AI defect inspection and classification  Support data integration with customer MES systems