VPTek Tornado 2000
VPTek Tornado 2000

    Model number： Tornado2000

    VPTek Tornado 2000

    Wafer surface defect inspection設備

    Quantity
    The Tornado 2000 is VPTek’s fully automated optical wafer inspection system designed for sub-micron precision. Its advanced dual-optical-path imaging system and multiple illumination options accommodate optical imaging challenges across a wide range of materials. Supporting D2D, D2G, C2C, D2DB, and AI inspection modes, it is suitable for large-die and non-array wafer defect inspection. The Tornado 2000’s flexible hardware and software configurations enable defect detection in both front-end and back-end processes. Key advantages include flexibility and ease of use, high efficiency, and low cost.

    Application Scenarios

    2D and 3D surface defect inspection for 4-, 6-, and 8-inch wafers across front-end, mid-end, back-end, and advanced packaging processes

    Key Features

    • Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
    • Dual Port cyclic loading and unloading reduces operator waiting time
    • Supports bright and dark field illumination to better capture subtle defects
    • Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers
    • Support partition inspection with multiple ROIs and layers
    • Support D2D、D2G and D2DB inspection algorithm
    • Support AI defect inspection and classification
    • Support data integration with customer MES systems
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