型号： Tornado2000
VPTek Tornado 2000
Wafer surface defect inspection设备
数量
Tornado 2000 是 VPTek 推出针对次微米级精度的晶圆全自动光学检测设备，先进的双光路光学影像系统及多种照明方案，适应各类不同材质的光学影像问题，支持D2D、D2G、C2C、D2DB、AI 等检测模式，可适用大尺寸 DIE、非数组式排布的晶圆缺陷，Tornado 2000 灵活的软硬件配置，可适用于前段、后段制程的缺陷侦测。具备灵活易用、高效率、低成本等重大优势。
Application Scenarios
针对4、6、8吋晶圆前段、中段、后段及先进封装过程中的表面2D及3D缺陷检测
Key Features
- Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
- Dual Port cyclic loading and unloading reduces operator waiting time
- Supports bright and dark field illumination to better capture subtle defects
- Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers
- Support partition inspection with multiple ROIs and layers
- Support D2D、D2G and D2DB inspection algorithm
- Support AI defect inspection and classification
- Support data integration with customer MES systems
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