VPTek Tornado 3000
VPTek Tornado 3000

    Model number： Tornado3000

    VPTek Tornado 3000

    Wafer surface defect inspection設備

    Quantity
    The Tornado 3000 is VPTek’s fully automated optical wafer inspection system for 8- and 12-inch wafers at sub-micron precision. Built on the proven Tornado 2000 architecture, it delivers continuous improvements in optical imaging resolution through further optimization of the optical system, enabling it to meet increasingly demanding process requirements.

    Application Scenarios

    2D and 3D defect inspection for 8- and 12-inch wafers across front-end, mid-end, and advanced packaging processes

    Key Features

    • Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
    • Dual light path array + area array imaging system, fast scanning
    • UV based optical system can better capture subtle defects
    • Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
    • Support partition inspection with multiple ROIs and layers
    • Support D2D, D2G, D2DB inspection algorithms
    • Support AI defect inspection and classification
    • Support data integration with customer MES systems
    Close