型番： Tornado3000
VPTek Tornado 3000
Wafer surface defect inspection設備
数量
Tornado 3000 是 VPTek 推出針對 8、12 吋次微米級精度的晶圓全自動光學檢測設備，基於 Tornado 2000 的成熟架構，透過對光學系統的進一步升級最佳化，不斷提升光學系統影像解析度，以適應更為苛刻的製程要求。
Application Scenarios
針對 8、12 吋晶圓前段、中段、及先進封裝過程中的 2D、3D 缺陷檢測
Key Features
- Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
- Dual light path array + area array imaging system, fast scanning
- UV based optical system can better capture subtle defects
- Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
- Support partition inspection with multiple ROIs and layers
- Support D2D, D2G, D2DB inspection algorithms
- Support AI defect inspection and classification
- Support data integration with customer MES systems
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