型号： Tornado3000
VPTek Tornado 3000
Wafer surface defect inspection设备
数量
Tornado 3000 是 VPTek 推出针对 8、12 吋次微米级精度的晶圆全自动光学检测设备，基于 Tornado 2000 的成熟架构，透过对光学系统的进一步升级优化，不断提升光学系统影像分辨率，以适应更为苛刻的制程要求。
Application Scenarios
针对 8、12 吋晶圆前段、中段、及先进封装过程中的 2D、3D 缺陷检测
Key Features
- Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
- Dual light path array + area array imaging system, fast scanning
- UV based optical system can better capture subtle defects
- Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
- Support partition inspection with multiple ROIs and layers
- Support D2D, D2G, D2DB inspection algorithms
- Support AI defect inspection and classification
- Support data integration with customer MES systems
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